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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 1/7
H432 Series
ADJUSTABLE SHUNT REGULATOR
H432 Series Pin Assignment
3-Lead Plastic SOT-23 Package Code: N Pin 1: Reference Pin 2: Cathode Pin 3: Anode 3-Lead Plastic SOT-89 Package Code: M Pin 1: Reference Pin 2: Anode Pin 3: Cathode 3-Lead Plastic TO-92 Package Code: A Pin 1: Reference Pin 2: Anode Pin 3: Cathode
3 2
Description
The H432 series are three-terminal adjustable regulators with guaranteed thermal stability over applicable temperature ranges. The output voltage may be set to any value between VREF (approximately 1.24 or 1.25 volts) and 30 volts with two external resistors. These devices have a typical dynamic output impedance of 0.2. Active output circuitry provides a very sharp turn-on characteristic, making these devices excellent replacement for zener diodes in many applications.
1
1
2
3
Features
* Programmable output voltage * Temperature coefficient is 50ppm/oC typical * Temperature compensated for operation over full temperature range * Low output noise voltage * Fast turn on response
1
2 12
3 3
Ordering Information
Package SOT-23 SOT-89 TO-92 VREF 1.24V2% H432AN H432AM H432AA VREF 1.24V1% H432BN H432BM H432BA VREF 1.24V0.5% H432CN H432CM H432CA VREF 1.25V2% H432DN H432DM H432DA VREF 1.25V1% H432EN H432EM H432EA VREF 1.25V0.5% H432FN H432FM H432FA
Absolute Maximum Ratings
(Operating temperature range applies unless otherwise specified) Characteristics Cathode Voltage Cathode Current Range (Continuous) Reference Input Current Range Power Dissipation Operating Temperature Range Junction Temperature Storage Temperature Range Symbol VKA IK IREF PD Topr TJ Tstg Value 30 50 0.05~+10 SOT-23 280 SOT-89 770 TO-92 770 0~+70 150 -65~+150 Unit V mA mA mW
o o
C C o C
Operating Conditions
Characteristics Cathode Voltage Cathode Current Range (Continuous) Symbol VKA IK Min. VREF 1 Typ. 10 Max. 30 Unit V mA
H432 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Functional Block Diagram & Symbol
Functional Block Diagram Symbol
Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 2/7
Cathode
+ Cathode
Reference VREF
-
Reference
Anode
Anode
Test Circuits
Fig 1. VK=VREF II VIN IREF IK VREF R2 VREF VK VIN R1 Fig 2. VK>VREF II VK VIN VK Fig 3. Off-State Current
IREF IK IOFF
Note: VK=VREF(1+R1/R2)+IREFxR1
Electrical Characteristics (Ta=25oC unless otherwise specified)
Characteristics H432AN/AM/AA H432BN/BM/BA H432CA/CM/CA H432DN/DM/DA H432EN/EM/EA H432FN/FM/FA Symbol Test Conditions Min 1.215 1.228 1.234 1.225 1.238 1.244 Typ 1.24 1.24 1.24 1.25 1.25 1.25 4 -1.4 -1 1 0.4 0.4 0.1 Max 1.265 1.252 1.246 1.275 1.262 1.256 17 -2.7 -2 4 1.2 1 1 Unit
Reference Input Voltage (Fig1)
VREF
VK=VREF, IK=10mA
V
Deviation of Reference Input Voltage OverTemperature (Fig1)
VREF(dev)
Ratio of Change in Reference Input Voltage to VREF / the Change in Cathode Voltage (Fig2) VK Reference Input Current (Fig2) Deviation of Reference Input Current Over Full Temperature Range (Fig2) Minimum Cathode Current for Regulation (Fig1) Off-State Cathode Current (Fig3)
H432 Series
VK=VREF, IK=10mA TminTaTmax IK=10mA, VK=10V to VREF IK=10mA, VK=30V to 10V IK=10mA, R1=10k, R2= IK=10mA, R1=10k, R2=, Ta=Full Range VK=VREF VK=30V, VREF=0
mV mV/V mV/V uA uA mA uA
IREF IREF(dev) IK(min) IK(off)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Cathode Current & Cathode Voltage
20 15
Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 3/7
Change in Reference Input Voltage & Cathode Voltage
0 Change in Reference Input Voltage (mV) -2 -4 -6 -8 -10 -12 -14 -16 -18 -20
10 Cathode Current (mA) 5 0 -5 -10 -15 -20 -25 -1 -0.5 0 0.5 Cathode Voltage (V) 1 1.5 VK=VREF, Ta=25 C Test Circuit (Fig1)
o
0
10
20 Cathode Voltage (V)
30
40
Reference Input Voltage & Temperature
1.248 1.246 Reference Input Voltage (V) 1.244 1.242 1.24 1.238 1.236 1.234 -20 0 20 40 60 o Temperature ( C) 80 100 120 VK=VREF, IK=10mA Test Circuit (Fig1) 300 200 100 0 -100 -200 -300 -400 -1
Cathode Current & Cathode Voltage
Cathode Current (uA)
VK=VREF, Ta=25 C Test Circuit (Fig1)
o
-0.5
0 0.5 Cathode Voltage (V)
1
1.5
Small Signal Voltage Amplification & Frequency
60 50 Voltage Amplification (dB) 40 30
Vout
20
+
6.8K
Ik
180
10 0 -10 100
10uF 4.3K
5V GND
1000
10000 100000 Frequency (Hz)
1000000
10000000
H432 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Typical Application
Fig 4. Shunt Regulator
Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 4/7
Fig 5. High Current Shunt Regulator
Vcc R1
Vout
Vcc R1
Vout
R2
R2
Vout=(1+R1/R2)VREF
Vout=(1+R1/R2)VREF
Fig 6. Output Control of a Three-Terminal Fixed Regulator
Fig 7. Series Pass Regulator
Vcc
H7805
IN OUT COMMON
Vcc
Vout R1
Vout R1
R2
R2
Vout=(1+R1/R2)VREF; Vout(min)=VREF+5V
Vout=(1+R1/R2)VREF; Vout(min)=VREF+VBE
Fig 8. Current Limiter or Current Source
Fig 9. Constant Current Sink
Vcc
Vcc RCL Iout
Isink
Rs
Iout=VREF/RCL
Isink=VREF/RS
H432 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
C H
Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 5/7
Marking:
Date Code HSMC Logo H432 Control Code
Pb-Free: " . " (Note) Normal: None
Pb Free Mark
B 1 E F G A 2 3
D
Note: Green label is used for pb-free packing
J
I
Pin Style: 1.Reference 2.Anode 3.Cathode Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I
Min. 4.40 4.05 1.50 2.40 0.36 *1.50 *3.00 1.40 0.35
Max. 4.60 4.25 1.70 2.60 0.51 1.60 0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M
TO-92 Dimension
A B
1 2 3
2
Marking:
Pb Free Mark
Pb-Free: " . " (Note) Normal: None
H 432
A
3
Date Code
Control Code
C
Note: Green label is used for pb-free packing
D
Pin Style: 1.Reference 2.Anode 3.Cathode Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I 1 2 3
Min. 4.33 4.33 12.70 0.36 3.36 0.36 -
Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27 *5 *2 *2
H I E F
G
*: Typical, Unit: mm
1
3-Lead TO-92 Plastic Package HSMC Package Code: A
H432 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Marking:
A L
Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 6/7
432
3
Pb Free Mark
Pb-Free: " " (Note) Normal: None
BS
1 2
Note: Pb-free product can distinguish by the green label or the extra description on the right side of the label. Pin Style: 1.Reference 2.Cathode 3.Anode Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
V
G
DIM A B C D G H J K L S V
Min. 2.80 1.20 0.89 0.30 1.70 0.013 0.085 0.32 0.85 2.10 0.25
Max. 3.04 1.60 1.30 0.50 2.30 0.10 0.177 0.67 1.15 2.75 0.65
*: Typical, Unit: mm
C D H
3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N
K
J
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
H432 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC's Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile
tP TP Ramp-up TL Tsmax Temperature tL
Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 7/7
Critical Zone TL to TP
Tsmin tS Preheat
Ramp-down
25 t 25oC to Peak Time
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices.
Sn-Pb Eutectic Assembly <3 C/sec 100oC 150oC 60~120 sec <3oC/sec 183oC 60~150 sec 240oC +0/-5oC 10~30 sec <6oC/sec <6 minutes
o
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 sec <3oC/sec 217oC 60~150 sec 260oC +0/-5oC 20~40 sec <6oC/sec <8 minutes
Peak temperature 245 C 5 C
o o
Dipping time 5sec 1sec 5sec 1sec
260 C +0/-5 C
o
o
H432 Series
HSMC Product Specification

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